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Xiaomi MI5S Pro Tear Down Review

Xiaomi MI5S Pro Tear Down Review

Posted on September 29, 2016December 20, 2018 By Jarvis

Xiaomi MI5S and Xiaomi MI5S Plus have started to sell now. And the main feature of MI5S is the ultrasonic fingerprint scanner under glass and ‘Dark Eye’ camera. Today we will tear down Xiaomi MI5S Pro with Snapdragon 821 processor, RAM 4GB ROM 128GB, 3D Touch. According to the tear down, we can know Xiaomi MI5S internal layout, and the back metal cover processing is exquisite, and makes nice process in its cooling.
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Read full post here:
http://www.igeekphone.com/xiaomi-mi5s-pro-tear-down-review/

Phones Tags:3D, camera, fingerprint, processor, ram, review, Snapdragon, Xiaomi

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