Qualcomm recently announced its new premium mobile chipset, the Snapdragon 855. Like with previous iterations, the new promises better performance and new features to power the next-gen flagship devices. What are improvements? Find out below.
It’s predecessor, the Snapdragon 845, was manufactured using the 10nm LPP FinFET process technology. For the Snapdragon 855, Qualcomm used the 7nm process technology, similar to the HiSilicon Kirin 980. This means that the SD855 will pack more processing power and better power efficiency.
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