Qualcomm has unveiled the next-generation of its 3D Sonic under-display fingerprint sensor, which could get a quick debut within the Samsung Galaxy S21 smartphones.

The new, second-generation 3D Sonic Sensor is 50% faster than the original, the chipmaker says, thanks to its ability to collect 1.7x more biometric data. Qualcomm says the new sensor has a 77% larger read area (8mm x 8mm compared with 7mm x 4mm) than its predecessor, but is only 0.2mm thick, making it easier for smartphone manufacturers to include the reader within “cutting edge form factors.”
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