Apparently, AMD was considering implementing Intel’s Foveros 3D technology at some point, but later decided to develop a better proprietary Micro Bump 3D packaging that is 1 micron thinner and quite a bit more efficient. This is only the beginning, as AMD plans to refine the interconnect pitch in the future, allowing for more complex 3D stacking applications.
The jump to Zen 4 is not happening this year, but AMD already has an answer for Intel’s Alder Lake platform.
The Legion 5 Pro is an outstanding device that brings everything to the table. A premium aluminum unibody, a minimalistic Read more
It’s great when laptops come out which give you both an AMD and an Intel variant right from the start, Read more
When we reviewed the AMD variant of Lenovo Legion 5 Pro (16″) we concluded that it’s a solid device. This Read more
HP has revealed a new All-in-One Desktop PC, the HP Envy 34. Not only does the machine feature a 21:9 Read more
The story of AMD CPUs in Lenovo's ThinkPad laptops is a story of inequality. AMD systems were disadvantaged from the Read more
The XMG FOCUS 17 M21 has a 17.3-inch display, an Intel Core i7-11800H and an NVIDIA GeForce RTX 3050 Ti Read more
Intel's DDR5 implementation could be one of those cases where first to market does not necessarily translate to a huge Read more
Another leak around Intel’s incoming Arc gaming graphics cards shows again that the flagship GPU could be pitched against the Read more
Everything you need to know about Intel Alder Lake, 12th Gen chips coming to laptops and desktops later this year. Read more
A leaked Intel slide indicates that the company's upcoming DG2 Arc Alchemist GPU could be targeting the Nvidia GeForce RTX Read more
Unfortunately no gaming tests, but we are still getting a first look at more relevant benchmarks like video encoding, CPU Read more
The unannounced Galaxy Book appears to integrate an early sample of the Alder Lake-P that only runs at 2.25 GHz. Read more