AMD made some news last night during its Computex 2021 keynote address when AMD CEO Dr. Lisa Su showed off the company’s new 3D chiplet technology, developed in partnership with TSMC.
The long and short of it is that rather than spread itself out over a wider die, CPU components like the logic unit and cache memory are stacked on top of each other, utilizing vertical space rather than growing the total surface area of the chip in a flat wafer.
While the technology is primarily being pioneered by TSMC, AMD looks to be the first chipmaker to take advantage of the new process by introducing new “vertical L3 cache” to its Ryzen series processors.
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