Apparently, AMD was considering implementing Intel’s Foveros 3D technology at some point, but later decided to develop a better proprietary Micro Bump 3D packaging that is 1 micron thinner and quite a bit more efficient. This is only the beginning, as AMD plans to refine the interconnect pitch in the future, allowing for more complex 3D stacking applications.
The jump to Zen 4 is not happening this year, but AMD already has an answer for Intel’s Alder Lake platform.
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