Back in October 2023, Ming-Chi Kuo reported that Apple was exploring the use of resin-coated copper (RCC) components for the iPhone’s logic board in an effort to save space within as the outside thickness was reduced. However, a new report from the same source claims that won’t be happening after all. In a post on X (formerly Twitter), Kuo says Apple won’t be using the new material in the iPhone 17 due to supplier Ajinomoto’s “inability to meet Apple’s high-quality requirements.”
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