Intel reveals more about its Lakefield stacked CPU, due to ship in late 2019

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We still don’t know what kinds of PCs will use it, though we suspect it will be thin-and-light laptops.

Intel executives said Tuesday that its hybrid Lakefield architecture will ship late in the fourth quarter, followed by future revisions that will shrink the design further.

Previously, Intel has said only that Lakefield will ship in 2019.

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https://www.pcworld.com/article/3433258/intel-reveals-more-about-its-lakefield-stacked-cpu-due-to-ship-in-late-2019.html

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