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Micron new UFS 3.1 module

The Honor Magic3 series will be the first smartphones to launch with Micron’s latest, 176-layer type of UFS 3.1 internal storage

Posted on August 2, 2021August 27, 2023 By Jarvis

Micron has put its latest kind of flash storage for mobile devices into production. It has the OEM’s state-of-the-art 176-layer NAND technology, as well as the most up-to-date UFS 3.1 read and write speeds. The brand Honor has lost no time in announcing that its upcoming Magic3 flagship series will debut with this spec.
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